Master Bond has designed EP5TC-80, a new one part epoxy which has a NASA low outgassing rating and achieves high thermal conductivity.
The Master Bond EP5TC-80 possesses a thermal conductivity of 3.3 – 3.7 W/(m·K), while also retaining its electrical non-conductivity. The epoxy can fully cure at 80°C within 1.5 – 2 hours. To optimise its performance properties, Master Bond recommends a post cure of 1 – 2 hours at 80°C.
EP5TC-80 is electrically insulating, features a low thermal resistance and can be applied in very thin sections due to its fine particle filler. This high strength system has a tensile modulus exceeding 1.5 million psi and a compressive strength ranging between 25,000 psi – 27,000 psi.
Featuring a thixotropic paste consistency, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many plastics. The epoxy is formulated for bonding, sealing and small encapsulating applications.
The new epoxy demonstrates good dimensional stability with a low shrinkage upon cure, a Shore D hardness of 90 – 100, and an elongation of 0.5% – 1.5%. The product is serviceable over a temperature range of -50°C to +150°C and has a glass transition temperature of 110°C – 115°C. Packaging is available in 3cc, 5 c, 10cc and 30cc syringes and ships in dry ice.
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