Loctite range adds electrically conductive adhesive 14 December 2022

Henkel has recently introduced an electrically conductive adhesive specially designed to accommodate the complexity behind compact camera modules. The adhesive possesses characteristics which allows it to safeguard thin, miniaturised substrates within mobile device camera components.

The new Loctite Ablestik ICP 212 is a moisture cure chemically conductive adhesive which cures at room temperature, helps improve yield rates and protects the sensitive structures of mobile camera modules. 

“Loctite Ablestik ICP 2120 demonstrates the power of Henkel’s broad technology toolbox. Many electrically conductive adhesive materials are solvent cure adhesives that require high temperature to fully cure. Loctite Ablestik ICP 2120 uses a unique chemistry platform, creatively engineered through Henkel’s scientific know-how, to satisfy demanding mass production and performance requirements,” explains Toshiki Natori, electronics product development director, Henkel. 

In addition to its core electrical advantages, Loctite Ablestik’s distinctive chemistry provides a low modulus to ensure better drop performance. Additionally, the adhesive offers a curing profile for a fast cure, either at room or low temperature, to enable high volume processing, substrate protection and reduced energy consumption. Excessive heating of smaller, thinner, more compact camera module substrates can cause them to warp or shrink, which impacts the optical performance and decreases yield. Therefore, limiting high-temperature exposure is essential.  

To optimise its applications, as Loctite Ablestik has been designed for electrical grounding and its electrical properties have been optimised for high performance. The material has low direct contact resistance and low volume resistance to ensure thorough removal of electrostatic discharge from the substrate for robust operation. In addition, the adhesive has a high thermal conductivity of 7.0 W/mK to help dissipate operational heat.

While initially developed for compact camera modules, the characteristics of the new Loctite adhesive can also benefit other applications, such as OLED display grounding. “The attributes of this electrically conductive adhesive are quite distinct, allowing excellent electrical performance while protecting the delicate nature of many heat-sensitive miniaturised components and ensuring compatibility with high volume production environments,” adds Toshiki Natori.

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