Electrical + Electronics
Master Bond meets NASA specifications 24 August 2016

The EP3HTS-LO, a single component epoxy for demanding bonding, sealing and coating applications from Master Bond, has passed ASTM E595 tests for NASA low outgassing.

Ideal for use in the aerospace, electronic, microelectronic and optical industries, Master Bond says its EP3HTS-LO features a silver filler and is electrically conductive with a low volume resistivity of less than
0.001 ohm-cm. It also has a thermal conductivity of 12-15 BTU•in/(ft²•hr•°F) [1.73-2.16 W/(mK)].

EP3HTS is dimensionally stable and bonds well to metals, glass, composites, ceramics and many plastics. It withstands a variety of chemicals such as water, oils, fuels and cleaning agents. This high temperature resistant system is serviceable over the wide temperature range of -51°C to +204°C.
As a one part compound, EP3HTS-LO offers convenient handling with no mixing and an unlimited working life at room temperature. This smooth thixotropic paste can be readily dispensed from a syringe. It polymerises quickly at elevated temperatures with cure schedules of 45 – 50 minutes at 121°C or 20 – 30 minutes at 148°C.
EP3HTS-LO is available for use in glass jars and syringes. It has a minimum shelf life of 3 months and a maximum of 6 months at ambient temperatures in its original, unopened containers.
Claire Aldridge Deputy Editor t: +44 (0) 1727 743 889

Having spent a decade in the fastener industry experiencing every facet – from steel mills, fastener manufacturers, wholesalers, distributors, as well as machinery builders and plating + coating companies, Claire has developed an in-depth knowledge of all things fasteners.

Alongside visiting numerous companies, exhibitions and conferences around the world, Claire has also interviewed high profile figures – focusing on key topics impacting the sector and making sure readers stay up to date with the latest developments within the industry.